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in total 100 picecs
Communication module PCB

Communication module PCB

Substrate: FR4 Number of layers: 4 layers Dielectric constant: 4.2 Plate thickness: 1.0mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
Communication board PCB

Communication board PCB

Substrate: FR4 Number of layers: 2 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Thickness of inner copper foil:1OZ
Communication PCB

Communication PCB

Substrate: FR4 Number of layers: 4 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
Communication PCB

Communication PCB

Substrate: FR4 Number of layers: 4 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
Communication PCB

Communication PCB

Substrate: FR4-TG170 Number of layers: 10 layers Dielectric constant: 4.2 Plate thickness: 2.0mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
EOP Switch Motherboard

EOP Switch Motherboard

Substrate: FR4-TG170 Number of layers: 8 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
Communication module PCB

Communication module PCB

Substrate: FR4-TG170 Number of layers: 8 layers Dielectric constant: 4.2 Plate thickness: 1.2mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
Scan code mobile phone motherboard

Scan code mobile phone motherboard

Substrate: FR4-TG150 Number of layers: 6 Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
Bluetooth WIFIPCB

Bluetooth WIFIPCB

Substrate: FR4 Number of layers: 4 layers Dielectric constant: 4.2 Plate thickness: 0.8mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
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