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6-layer second-order HDI PCB

Substrate: FR4 Number of layers: 6 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ


4-layer first-stage HDI PCB

Substrate: FR4 Number of layers: 4 layers Dielectric constant: 4.2 Plate thickness: 1.0mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ


control mainboard

Substrate: FR4 Number of layers: 2 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: /


High precision impedance board

Substrate: FR4-TG170 Number of layers: 6 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ


Medical blood glucose meter PCB board

Substrate: FR4 Number of layers: 2 layers Dielectric constant: 4.2 Plate thickness: 0.8mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: /


Communication module PCB

Substrate: FR4 Number of layers: 4 layers Dielectric constant: 4.2 Plate thickness: 1.0mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ


Control motherboard

Substrate: FR4 Number of layers: 4 layers Dielectric constant: 4.2 Plate thickness: 1.0mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ


Industrial Control PCB

Substrate: FR4-TG170 Number of layers: 10 layers Dielectric constant: 4.2 Plate thickness: 2.0mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ


Four-layer first-order HDIPCB

Substrate: FR4 Number of layers: 4 layers Dielectric constant: 4.2 Plate thickness: 1.2mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ


Car light panel

Substrate: FR4 Number of layers: 2 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: /


Memory board PCB

Substrate: FR4 Number of layers: 2 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 3OZ Thickness of inner copper foil:/


Communication board PCB

Substrate: FR4 Number of layers: 2 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Thickness of inner copper foil:1OZ