Welcome to visit Ling Hangda's official website, focus on customized production of circuit board research and development!

Service hotline

CN | EN

control mainboard

Substrate: FR4 Number of layers: 2 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: /

Surface treatment:lead-free hot air solder level Minimum aperture: 0.3mm Minimum line width: 0.2mm Minimum line distance: 0.2mm Application field: control mainboard Features: high dependability

Classification:

Products

Industrial Control PCB

Key words:

Online message

Product Details

Product Video

Product Parameters

control mainboard

Substrate	FR4	Number of layers	2
dielectric constant	4.2	Plate thickness	1.6mm
Thickness of outer copper foil	1OZ	Thickness of inner layer copper foil	/
Surface treatment method	lead-free hot air solder level	Minimum aperture	0.3mm
Minimum line width	0.2mm	Minimum line spacing	0.2mm
Application areas	automobile	Features	high dependability

Product display

Process flow

Application Case

System Certificate

Since its establishment 20 years ago, Unice Group has passed the qualification recognition of ISO9001, ISO14001, ISO13485, IATF16949, CQC, UL of the United States, UL of Canada and so on. It is a PCB manufacturer worthy of your trust.

Online message

If you are interested in our products and want to know more details, please leave a message here and we will reply to you as soon as possible.

Related Products

6-layer second-order HDI PCB

Substrate: FR4 Number of layers: 6 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ

4-layer first-stage HDI PCB

Substrate: FR4 Number of layers: 4 layers Dielectric constant: 4.2 Plate thickness: 1.0mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ

control mainboard

Substrate: FR4 Number of layers: 2 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: /

High precision impedance board

Substrate: FR4-TG170 Number of layers: 6 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ

Shenzhen Linghangda Electronics Co., Ltd.

National free advice hotline:

400-8686-826

+8613828702435

Building C,D, Baishixia Industrial Zone, High-tech Park, Fuhai Street, Bao 'an District, Shenzhen

Public account

Business License

Digital Business Card

COOKIES

Our website uses cookies and similar technologies to personalize the advertising shown to you and to help you get the best experience on our website. For more information, see our Privacy & Cookie Policy

COOKIES

required

These cookies are necessary for basic functions such as payment. Standard cookies cannot be turned off and do not store any of your information.

analyze

These cookies collect information, such as how many people are using our site or which pages are popular, to help us improve the customer experience. Turning these cookies off will mean we can't collect information to improve your experience.

Feature

These cookies enable the website to provide enhanced functionality and personalization. They may be set by us or by third-party providers whose services we have added to our pages. If you do not allow these cookies, some or all of these services may not function properly.

advertise

These cookies help us understand what you are interested in so that we can show you relevant advertising on other websites. Turning these cookies off will mean we are unable to show you any personalized advertising.