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in total 100 picecs
6-layer second-order HDI PCB

6-layer second-order HDI PCB

Substrate: FR4 Number of layers: 6 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
4-layer first-stage HDI PCB

4-layer first-stage HDI PCB

Substrate: FR4 Number of layers: 4 layers Dielectric constant: 4.2 Plate thickness: 1.0mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
control mainboard

control mainboard

Substrate: FR4 Number of layers: 2 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: /
Control motherboard

Control motherboard

Substrate: FR4 Number of layers: 4 layers Dielectric constant: 4.2 Plate thickness: 1.0mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
Industrial Control PCB

Industrial Control PCB

Substrate: FR4-TG170 Number of layers: 10 layers Dielectric constant: 4.2 Plate thickness: 2.0mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
Industrial control PCB

Industrial control PCB

Substrate: FR4-TG150 Number of layers: 6 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
Industrial control PCB

Industrial control PCB

Substrate: FR4-TG150 Number of layers: 6 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
Industrial control PCB

Industrial control PCB

Substrate: FR4-TG170 Number of layers: 10 layers Dielectric constant: 4.2 Plate thickness: 2.0mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
Industrial Control PCB

Industrial Control PCB

Substrate: FR4 Number of layers: 8 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
Vernier caliper PCB

Vernier caliper PCB

Substrate: FR4 Number of layers: 6 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
Mining machine PCB

Mining machine PCB

Substrate: FR4 Number of layers: 8 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 2OZ Inner layer copper foil thickness: 2OZ
Samsung Burner PCB

Samsung Burner PCB

Substrate: FR4 Number of layers: 10 layers Dielectric constant: 4.2 Plate thickness: 2.0mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
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