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Process capability
Process capability and detection parameters Process capability and checking parameters |
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Serial Number No. |
Project Item |
Standard Standard |
Limit up to |
1 | Number of layers | 2 ~ 30 | 32 |
2 | Plate thickness | 0.15 ~ 6mm | 10mm |
3 | Maximum imposition size | 1200mm x 610mm | 2000mm x 620mm |
4 | Finish copper thickness | 1/3 ~ 6oz | 16oz |
5 | Minimum core plate thickness | 4mil | 3mil |
6 | aspect ratio | 8:1 | 12:1 |
7 | Minimum line width line spacing | 3/3mil | 2.5/2.5mil |
8 | Minimum aperture | 8mil | 4mil |
9 | Solder bridge (green) | 4mil | 3mil |
10 | Solder bridge (other colors) | 5mil | 4mil |
11 | Contour tolerance | /-5mil | /-2mil |
12 | Impedance control | +/-10% | +/-8% |
13 | PTH hole tolerance | /-0.075mm | /-0.05mm |
14 | NPTH Hole Tolerances | /-0.05mm | /-0.05mm |
15 | Hole position tolerance | /-0.05mm | /-0.05mm |
16 | Minimum BGA | 0.25mm | 0.17mm |
17 | Warpage | 0.75% | 0.5% |
18 | Material |
FR4, medium and high TG, metal base, halogen free, Rogers, Teflon, F4BM, Wangling, Zhongying, Panasonic M6, ceramic plate |
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19 | Surface treatment | Sink gold, OSP, spray tin, sink silver, sink tin, electric hard gold, electric soft gold, gold finger, sink gold OSP, spray tin gold finger, nickel palladium gold | |
20 | Thermal shock test | 288±5 ℃,10S,3times | |
21 | weldability test | 245±5℃,3sec Wetting area least 95% | |
22 | Ion Contamination Test | Pb,Hg,Cd,Cr(VI),PBB,PBDE six all ≦ 1000ppm | |
23 | Adhesion test | 260°C/-5, 10S,3times |
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