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4-layer first-stage HDI PCB

Substrate: FR4 Number of layers: 4 layers Dielectric constant: 4.2 Plate thickness: 1.0mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ

Surface treatment:lmmersion gold Minimum aperture: 0.25mm Minimum line width: 0.1mm Minimum line distance: 0.1mm Application field: Intelligent consumption Features: Laser drilling and blind hole burying

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Industrial Control PCB

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Product Parameters

4-layer first-stage HDI PCB

Substrate	FR4	Number of layers	4
dielectric constant	4.2	Plate thickness	1.0mm
Thickness of outer copper foil	1OZ	Thickness of inner layer copper foil	1OZ
Surface treatment method	Immersion gold	Minimum aperture	0.25mm
Minimum line width	0.1mm	Minimum line spacing	0.1mm
Application areas	Intelligent consumption	Features	Laser drilling and blind hole burying

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Since its establishment 20 years ago, Unice Group has passed the qualification recognition of ISO9001, ISO14001, ISO13485, IATF16949, CQC, UL of the United States, UL of Canada and so on. It is a PCB manufacturer worthy of your trust.

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