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Automotive Processor PCB

Substrate: FR4 Number of layers: 6 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ


Samsung Burner PCB

Substrate: FR4 Number of layers: 10 layers Dielectric constant: 4.2 Plate thickness: 2.0mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ


Harvard car light board

Substrate: FR4 Number of layers: 2 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Thickness of inner copper foil:/


Industrial control PCB

Substrate: FR4-TG150 Number of layers: 6 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ