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in total 100 picecs
Massage PCB

Massage PCB

Substrate: FR4 Number of layers: 4 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
Automotive PCB

Automotive PCB

Substrate: FR4 Number of layers: 4 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
Industrial control PCB

Industrial control PCB

Substrate: FR4-TG150 Number of layers: 6 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
Industrial control PCB

Industrial control PCB

Substrate: FR4-TG150 Number of layers: 6 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
Power PCB

Power PCB

Substrate: FR4 Number of layers: 4 layers Dielectric constant: 4.2 Plate thickness: 2.0mm Outer copper foil thickness: 3OZ Inner layer copper foil thickness: 3OZ
Industrial control PCB

Industrial control PCB

Substrate: FR4-TG170 Number of layers: 10 layers Dielectric constant: 4.2 Plate thickness: 2.0mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
Communication PCB

Communication PCB

Substrate: FR4-TG170 Number of layers: 10 layers Dielectric constant: 4.2 Plate thickness: 2.0mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
Industrial Control PCB

Industrial Control PCB

Substrate: FR4 Number of layers: 8 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
Decoding PCB

Decoding PCB

Substrate: FR4 Number of layers: 6 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
Computer peripheral products PCB

Computer peripheral products PCB

Substrate: FR4-TG170 Number of layers: 6 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
Gold Finger PCB

Gold Finger PCB

Substrate: FR4-TG170 Number of layers: 8 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
EOP Switch Motherboard

EOP Switch Motherboard

Substrate: FR4-TG170 Number of layers: 8 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
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