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in total 100 picecs
Power supply board

Power supply board

Substrate: FR4 Number of layers: 6 layers Dielectric constant: 4.2 Plate thickness: 2.0mm Outer copper foil thickness: 3OZ Inner layer copper foil thickness: 3OZ
Gold Finger PCB

Gold Finger PCB

Substrate: FR4-TG170 Number of layers: 10 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
Face Recognition PCB

Face Recognition PCB

Substrate: FR4-TG170 Number of layers: 8 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
Ash PCB

Ash PCB

Substrate: FR4 Number of layers: 6 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
Communication module PCB

Communication module PCB

Substrate: FR4-TG170 Number of layers: 8 layers Dielectric constant: 4.2 Plate thickness: 1.2mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
Half Hole Module PCB

Half Hole Module PCB

Substrate: FR4 Number of layers: 8 layers Dielectric constant: 4.2 Plate thickness: 1.2mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
Scan code mobile phone motherboard

Scan code mobile phone motherboard

Substrate: FR4-TG150 Number of layers: 6 Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
Thick copper power board

Thick copper power board

Substrate: FR4 Number of layers: 6 layers Dielectric constant: 4.2 Plate thickness: 2.0mm Outer copper foil thickness: 4OZ Inner layer copper foil thickness: 4OZ
Vernier caliper PCB

Vernier caliper PCB

Substrate: FR4 Number of layers: 6 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
Mining machine PCB

Mining machine PCB

Substrate: FR4 Number of layers: 8 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 2OZ Inner layer copper foil thickness: 2OZ
Vehicle PCB

Vehicle PCB

Substrate: FR4 Number of layers: 6 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
Bluetooth WIFIPCB

Bluetooth WIFIPCB

Substrate: FR4 Number of layers: 4 layers Dielectric constant: 4.2 Plate thickness: 0.8mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
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