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Power PCB

Substrate: FR4 Number of layers: 2 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 3OZ Thickness of inner copper foil:/


Rogers high frequency board

Substrate: Rogers RO4350B Number of layers: 4 Dielectric constant: 3.48 Plate thickness: 1.0mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ


Power PCB

Substrate: FR4 Number of layers: 4 layers Dielectric constant: 4.2 Plate thickness: 2.0mm Outer copper foil thickness: 3OZ Inner layer copper foil thickness: 3OZ


Power supply board

Substrate: FR4 Number of layers: 6 layers Dielectric constant: 4.2 Plate thickness: 2.0mm Outer copper foil thickness: 3OZ Inner layer copper foil thickness: 3OZ


Thick copper power board

Substrate: FR4 Number of layers: 6 layers Dielectric constant: 4.2 Plate thickness: 2.0mm Outer copper foil thickness: 4OZ Inner layer copper foil thickness: 4OZ
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