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Four-layer first-order HDIPCB

Substrate: FR4 Number of layers: 4 layers Dielectric constant: 4.2 Plate thickness: 1.2mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ


Memory board PCB

Substrate: FR4 Number of layers: 2 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 3OZ Thickness of inner copper foil:/


Smart Consumer PCB

Substrate: FR4 Number of layers: 4 layers Dielectric constant: 4.2 Plate thickness: 1.0mm Outer copper foil thickness: 2OZ Inner layer copper foil thickness: 2OZ


Decoding PCB

Substrate: FR4 Number of layers: 6 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ


Computer peripheral products PCB

Substrate: FR4-TG170 Number of layers: 6 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
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