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18
2024
-
07
HDI PCB manufacturers: Do you know the mysteries and advantages of HDI?
HDI, full name is High Density Interconnect, that is, high density interconnect technology. It is a response to the current electronic products more and more thin, short, complex structure, wide application of the development trend of advanced printed circuit board production technology. Because of its high signal transmission rate, excellent signal integrity and heat dissipation performance, HDI is favored by many electronic devices, communication products and consumer electronic products.
HDI, full name is High Density Interconnect, that is, high density interconnect technology. It is a response to the current electronic products more and more thin, short, complex structure, wide application of the development trend of advanced printed circuit board production technology. Because of its high signal transmission rate, excellent signal integrity and heat dissipation performance, HDI is favored by many electronic devices, communication products and consumer electronic products.
HDI is widely used in PCB(Printed Circuit Board, printed circuit board) manufacturers. In traditional PCB production, the arrangement of signal lines is relatively dense, and the comprehensive performance and signal transmission quality are limited. However, PCB manufacturers using HDI technology can use laser micro-hole drilling and high-density circuit layout design to make PCB have shorter circuit length and higher integration, thus improving the speed and performance of electronic products.
HDI PCB manufacturers need to have superb technical level and strict production quality control to ensure that the high-density circuit boards produced can meet customer needs. In addition, HDI PCB manufacturers have to face diversified and personalized customer needs. For specific functions, performance and material requirements put forward by customers, manufacturers need to make timely adjustments and provide high-quality after-sales service.
HDI technology will gradually become the mainstream in the future development. With the improvement of screen resolution of electronic products, the acceleration of signal transmission rate and the pursuit of thinning and miniaturization, HDI will be applied in more fields. In addition, the emergence of new technologies such as 5G communications, artificial intelligence, and the Internet of Things will further promote the development of HDI technology. HDI PCB manufacturers also need to keep pace with the times, continuously improve technology research and development and innovation capabilities, and provide better interconnection solutions for various electronic products around the world.
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