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Lamp PCB

Substrate: FR4 Number of layers: 2 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Thickness of inner copper foil:/


Industrial control PCB

Substrate: FR4-TG150 Number of layers: 6 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ


Industrial control PCB

Substrate: FR4 Number of layers: 6 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ


Bitcoin PCB

Substrate: FR4 Number of layers: 6 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ


Industrial control PCB

Substrate: FR4-TG170 Number of layers: 8 layers Dielectric constant: 4.2 Plate thickness: 1.2mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ


12OZ thick copper plate

Substrate: FR4-TG170 Number of layers: 2 layers Dielectric constant: 4.2 Plate thickness: 2.4mm Outer copper foil thickness: 12OZ Thickness of inner copper foil:/


Communication motherboard PCB

Substrate: FR4-TG170 Number of layers: 12 layers Dielectric constant: 4.2 Plate thickness: 2.0mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ


Communication Board PCB

Substrate: FR4-TG170 Number of layers: 6 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ


12OZ thick copper plate

Substrate: FR4 Number of layers: 2 layers Dielectric constant: 4.2 Plate thickness: 3.2mm Outer copper foil thickness: 12OZ Thickness of inner copper foil:/
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