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in total 100 picecs
Bitcoin PCB

Bitcoin PCB

Substrate: FR4 Number of layers: 6 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
Computer peripheral products PCB

Computer peripheral products PCB

Substrate: FR4-TG170 Number of layers: 6 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
Industrial control PCB

Industrial control PCB

Substrate: FR4-TG170 Number of layers: 8 layers Dielectric constant: 4.2 Plate thickness: 1.2mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
Gold Finger PCB

Gold Finger PCB

Substrate: FR4-TG170 Number of layers: 8 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
EOP Switch Motherboard

EOP Switch Motherboard

Substrate: FR4-TG170 Number of layers: 8 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
12OZ thick copper plate

12OZ thick copper plate

Substrate: FR4-TG170 Number of layers: 2 layers Dielectric constant: 4.2 Plate thickness: 2.4mm Outer copper foil thickness: 12OZ Thickness of inner copper foil:/
Power supply board

Power supply board

Substrate: FR4 Number of layers: 6 layers Dielectric constant: 4.2 Plate thickness: 2.0mm Outer copper foil thickness: 3OZ Inner layer copper foil thickness: 3OZ
Gold Finger PCB

Gold Finger PCB

Substrate: FR4-TG170 Number of layers: 10 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
Face Recognition PCB

Face Recognition PCB

Substrate: FR4-TG170 Number of layers: 8 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
Ash PCB

Ash PCB

Substrate: FR4 Number of layers: 6 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
Communication motherboard PCB

Communication motherboard PCB

Substrate: FR4-TG170 Number of layers: 12 layers Dielectric constant: 4.2 Plate thickness: 2.0mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
Communication module PCB

Communication module PCB

Substrate: FR4-TG170 Number of layers: 8 layers Dielectric constant: 4.2 Plate thickness: 1.2mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
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