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Security PCB

Substrate: FR4 Number of layers: 4 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ


Face Recognition PCB

Substrate: FR4-TG170 Number of layers: 8 layers Dielectric constant: 4.2 Plate thickness: 1.6mm Outer copper foil thickness: 1OZ Inner layer copper foil thickness: 1OZ
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